EPOXONIC® 371 - hot curing
Casting Potting
Potting compound for automotive, electrical, electronic and medical technology.
EPOXONIC® 371 is a solvent-free, filler-containing two-component casting resin system based on epoxy resin. EPOXONIC® 371 is particularly suitable for the potting of components with high requirements for chemical and temperature resistance.
Key features:
- Continuous temperature resistance up to 200 °C
- High glass transition temperature
- Excellent electrical insulation properties
- Low coefficient of thermal expansion
- Hydrolysis resistance
EPOXONIC GmbH specialises in the development and production of highly demanding adhesives and casting compounds.
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