EPOXONIC® 371 - hot curing

Casting Potting

Potting compound for automotive, electrical, electronic and medical technology.

EPOXONIC® 371 is a solvent-free, filler-containing two-component casting resin system based on epoxy resin. EPOXONIC® 371 is particularly suitable for the potting of components with high requirements for chemical and temperature resistance.

Key features:

  • Continuous temperature resistance up to 200 °C
  • High glass transition temperature
  • Excellent electrical insulation properties
  • Low coefficient of thermal expansion
  • Hydrolysis resistance
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EPOXONIC GmbH Reaktionsharzsysteme
Adhesive Bonding Technology

EPOXONIC GmbH specialises in the development and production of highly demanding adhesives and casting compounds.

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Features

Sector expertise
Manufacuting industry
Adhesive and sealant systems
Potting
Components
2-part systems
2-part systems
2-part epoxy resins
Size of application area
µm²-/µm³ range - micro parts
mm²-/mm³range - precision parts
cm²-/cm³ range - component
Curing mechanisms
hot curing
Pot life @ +20/23°C - Minimum / minutes
16-30 min
31-59 min
(Mixed) viscosity
medium viscosity
high viscosity
Packaging unit
tube, can, canister
Physical characteristics
hydrolysis resistance
temperature resistance <0°C (approx.)
from -40°C
from -30°C
from -20°C
temperature resistance >0°C (approx.)
to +160°C
to +180°C
to +200°C
colour and colour fastness
grey
Shore-D
Sh-D 81 to 100
Ecological requirements
VOC-free
Medium nature
filled
Machine & Production Engineering / electrical engineering
casting of components

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