EPOXONIC® 370

Adhesive Bonding Technology

Thixotropic, toughened adhesive for Automotive and Electrical Engineering.

EPOXONIC® 370 is a solvent-free, mineral filled 2-part adhesive based on epoxy resin. EPOXONIC® 370 is especially suited for bonding of substrates with different thermal expansion. Curing can be done at room temperature, but optimum properties will be achieved by curing at higher temperatures.

Main characteristics:

  • High chemical resistance
  • Excellent crack resistance
  • Very good adhesion to aluminium and many plastics
  • Outstanding impact resistance
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EPOXONIC GmbH Reaktionsharzsysteme
Adhesive Bonding Technology

EPOXONIC GmbH specialises in the development and production of highly demanding adhesives and casting compounds.

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Features

Sector expertise
Manufacturing industry
Adhesive and sealant systems
Adhesive
Components
2-part systems
2-part systems
2-part epoxy resins
High Performance Plastics
PPS
Thermoplastics
PA (PA 6.6)
PBT
PC
Metals
aluminium
Size of application area
mm²-/mm³range - precision parts
cm²-/cm³ range - component
Curing mechanisms
room temperature curing
chemical curing
Pot life @ +20/23°C - Minimum / hours
1-2 h
(Mixed) viscosity
pasty
thixotropic
Packaging unit
tube, can, canister
customized packaging
temperature resistance <0°C (approx.)
from -40°C
from -30°C
from -20°C
temperature resistance >0°C (approx.)
to +130°C
to +140°C
to +150°C
colour and colour fastness
colour spectrum bright
grey
Shore-D
Sh-D 61 to 80
Ecological requirements
VOC-free
Media profile
filled

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