EPOXONIC® 283 - moderate curing temperature

Casting Potting

Impact resistant potting compound for Microelectronics and Electrical Engineering.

EPOXONIC® 283 is a solvent-free, mineral filled 2-part potting compound based on epoxy resin. EPOXONIC® 283 is especially suited for potting of temperature sensitive electronic devices with high demands on mechanical properties (e.g. Automotive Electronics) as well as high-voltage devices (e.g. high-voltage plugs).

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EPOXONIC GmbH Reaktionsharzsysteme
Adhesive Bonding Technology

EPOXONIC GmbH specialises in the development and production of highly demanding adhesives and casting compounds.

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Features

Sector expertise
Manufacturing industry
Adhesive and sealant systems
Potting
Components
2-part systems
2-part systems
2-part epoxy resins
Size of application area
µm²-/µm³ range - micro parts
mm²-/mm³range - precision parts
cm²-/cm³ range - component
Curing mechanisms
moderate curing temperature
Pot life @ +20/23°C - Minimum / minutes
16-30 min
(Mixed) viscosity
medium viscosity
Packaging unit
hobbock
customized packaging
temperature resistance <0°C (approx.)
from -40°C
from -30°C
from -20°C
temperature resistance >0°C (approx.)
to +130°C
to +140°C
to +150°C
colour and colour fastness
black
Shore-D
Sh-D 81 to 100
deformation capability
≤ 10%
against substances (non-binding information)
highly resistant (advice required)
Ecological requirements
VOC-free
Media profile
filled
Machine & Production Engineering / electrical engineering
high voltage plug
casting of components

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