EPOXONIC® 382

Adhesive Bonding Technology

2-Part-Adhesive suitable for room temperature curing.

EPOXONIC® 382 is a solvent-free 2-part adhesive based on epoxy resin. EPOXONIC® 382 is characterized by very low viscosity and proper curing at room temperature, even in thin layers. Large area bonding of temperature-sensitive substrates can be realized.

Main characteristics:

  • Low viscosity
  • Room temperature cure
  • Transparency
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EPOXONIC GmbH Reaktionsharzsysteme
Adhesive Bonding Technology

EPOXONIC GmbH specialises in the development and production of highly demanding adhesives and casting compounds.

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Features

Sector expertise
Manufacuting industry
Adhesive and sealant systems
Adhesive
Components
2-part systems
2-part systems
2-part epoxy resins
Thermoplastics
ABS
PA (PA 6)
PA (PA 6.6)
PC
PVC (harder perfomance)
Metals
aluminium
Size of application area
cm²-/cm³ range - component
m² range - workpiece
Curing mechanisms
room temperature curing
chemical curing
Pot life @ +20/23°C - Minimum / minutes
16-30 min
Processability (approx.)
≤ 12 hours
(Mixed) viscosity
low viscosity
Packaging unit
tube, can, canister
customized packaging
colour and colour fastness
transparent
yellow
Shore-D
Sh-D 81 to 100
deformation capability
≤ 10%
Ecological requirements
VOC-free

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