EPOXONIC® 281- moderate curing temperature

Casting Potting

Potting compound for Microelectronics and Electrical Engineering.

EPOXONIC® 281 is a solvent-free, mineral filled 2-part potting compound based on epoxy resin. EPOXONIC® 281 is especially suited for potting of temperature sensitive devices with high requirements for electrical insulation and flame retardancy.

Main characteristics:

  • Long-term heat resistance to 150 °C
  • Thermal shock resistance
  • Moderate curing temperature
  • Outstanding electrical insulation properties
  • High thermal conductivity
  • Low thermal expansion
  • Chemical resistance
  • Flame-resistance
  • Low viscosity
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EPOXONIC GmbH Reaktionsharzsysteme
Adhesive Bonding Technology

EPOXONIC GmbH specialises in the development and production of highly demanding adhesives and casting compounds.

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Features

Sector expertise
Manufacuting industry
Adhesive and sealant systems
Potting
Components
2-part systems
2-part systems
2-part epoxy resins
Size of application area
µm²-/µm³ range - micro parts
mm²-/mm³range - precision parts
cm²-/cm³ range - component
Curing mechanisms
moderate curing temperature
Pot life @ +20/23°C - Minimum / minutes
31-59 min
(Mixed) viscosity
medium viscosity
high viscosity
temperature resistance <0°C (approx.)
from -40°C
from -30°C
from -20°C
temperature resistance >0°C (approx.)
to +130°C
to +140°C
to +150°C
colour and colour fastness
green
Shore-D
Sh-D 81 to 100
conductivity
electrically insulating
heat-conductive
against substances (non-binding information)
highly resistant (advice required)
Ecological requirements
VOC-free
Medium nature
filled
Microtechnology / encapsulation
Encapsulation of electronic assemblies
Machine & Production Engineering / electrical engineering
casting of components

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