EPOXONIC® 366

Adhesive Bonding Technology

Potting compound/Adhesive for Automotive Engineering.

EPOXONIC® 366 is a solvent-free, mineral filled 1-part potting compound based on epoxy resin. EPOXONIC® 366 is especially suited as potting compound/adhesive for automotive engineering, e.g. potting of sensors.

Main characteristics:

  • High mechanical strength
  • High glass transition temperature
  • 1-part system („Frozen product“)
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EPOXONIC GmbH Reaktionsharzsysteme
Adhesive Bonding Technology

EPOXONIC GmbH specialises in the development and production of highly demanding adhesives and casting compounds.

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Features

Sector expertise
Manufacuting industry
Adhesive and sealant systems
Adhesive
Potting
Components
1-part systems
1-part systems
1-part epoxy resins
Thermosetting Plastics
EP
Size of application area
µm²-/µm³ range - micro parts
mm²-/mm³range - precision parts
cm²-/cm³ range - component
Curing mechanisms
warm-/hot curing
Pot life @ +20/23°C - Minimum / hours
5-12 h
(Mixed) viscosity
high viscosity
pasty
Packaging unit
cartridge (1- or 2-part)
customized packaging
colour and colour fastness
black
Shore-D
Sh-D 81 to 100
conductivity
heat-conductive
Ecological requirements
VOC-free
Medium nature
filled
Mobility - Land Transportation / vehicle electronics
sensor bondings
White Goods & Consumer Electronics / microelectronics / optics / sensor systems
components & housings
sensor bondings

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