EPOXONIC® 373 - flexible

Casting Potting

Flexible, flame-resistant potting compound for Automotive Engineering, Microelectronics and Electrical Engineering.

EPOXONIC® 373 is a solvent-free, mineral filled 2-part potting compound based on epoxy resin. EPOXONIC® 373 is especially suited for low stress potting of pressure sensitive electronic devices (e.g. inductive components, sensors).

Main characteristics:

  • Heat resistance to 150 °C
  • Thermal shock resistance
  • Flexibility
  • High thermal conductivity
  • Long pot life
  • Flame-resistance
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EPOXONIC GmbH Reaktionsharzsysteme
Adhesive Bonding Technology

EPOXONIC GmbH specialises in the development and production of highly demanding adhesives and casting compounds.

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Features

Sector expertise
Manufacuting industry
Adhesive and sealant systems
Potting
Components
2-part systems
2-part systems
2-part epoxy resins
Size of application area
mm²-/mm³range - precision parts
cm²-/cm³ range - component
Curing mechanisms
hot curing
Pot life @ +20/23°C - Minimum / hours
> 12 h
(Mixed) viscosity
high viscosity
Packaging unit
tube, can, canister
customized packaging
Physical characteristics
vibration reduction
temperature resistance <0°C (approx.)
from -40°C
from -30°C
from -20°C
temperature resistance >0°C (approx.)
to +130°C
to +140°C
to +150°C
colour and colour fastness
black
Shore-A
Sh-A 81 to 100
conductivity
heat-conductive
deformation capability
≤ 50%
UL Underwriters Laboratories
UL 94 V-0 or 1
Ecological requirements
VOC-free
Medium nature
filled
Mobility - Land Transportation / vehicle electronics
sensor bondings
Microtechnology / encapsulation
Encapsulation of electronic assemblies
Machine & Production Engineering / electrical engineering
casting of components

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