Kisling 1665

Adhesive Bonding Technology

1665 is a non-sagging, two-part methacrylate adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.

Combined at a 10:1 ratio, it has a working time of 3 to 6 minutes. 50% of final strength (@23°C) will be achieved already within 15 to 18 minutes. 1665 is mainly used as an universal grade for industrial applications where composites are involved. Normally it does not require any surface preparation.

Advantages

  • Good adhesion to a wide range of materials
  • Non-dropping paste
  • Bridges gaps up to 10 mm
  • Excellent resistance against dynamic loads
  • Resistant against outside conditions and humidity
  • 100% reactive compound
Find out more
Kisling AG
Adhesive Bonding Technology

Kisling is a leading manufacturer of high-quality adhesives, sealants and encapsulants for almost every line of industry- electronics, mechanical engineering, pump and valve construction and mobility.

Features

Sector expertise
Manufacuting industry
Adhesive and sealant systems
Adhesive
Components
2-part systems
2-part systems
methylmethacrylate
Thermoplastics
ABS
ASA
PC
PMMA
PUR (lower degree of cross-linking)
PVC (harder perfomance)
PVC (softer perfomance)
SAN
Thermosetting Plastics
EP
MF
PF
PUR (higher degree of cross-linking)
UP
Composites
CRP
BMC
FR4
GRP
SMC
Metals
aluminium
bronze
chromium
gold
cast iron
copper
magnesium
magnets
brass
nickel
platinum
silver
silicium
steel - blasted SA 2,5
steel - chromated
steel - stainless
steel - galvanised
titanium
zinc (also galvanized materials)
tin
Glass & Ceramic Materials
glass
ceramics
ceramic (techno-)
porcelain
Paper & Cardboard
alu-coated materials
Wood & Timber
solid timber - untreated
MDF - medium density fiberboard
Size of application area
mm²-/mm³range - precision parts
cm²-/cm³ range - component
m² range - workpiece
Curing mechanisms
room temperature curing
Pot life @ +20/23°C - Minimum / minutes
1-5 min
(Mixed) viscosity
pasty
Packaging unit
cartridge (1- or 2-part)
temperature resistance <0°C (approx.)
from -55°C
temperature resistance >0°C (approx.)
to +120°C
gap filling properties
≤ 10mm
deformation capability
≤ 150%
Application Types
dot application
line, bead application
Anchoring & Fixing
screw thread - through hole
screw thread - pocket hole bore
chemical screw retention
chemical anchoring systems

Contact Form

The search results from SUBSTRATEC are not sales recommendations and/or professional technical advice. It is only intended to make it easier for the user to pre-select suitable system that may be available. SUBSTRATEC gives no guarantee that the system suggested is successful or suitable for the specific area of application of the user. In the event of any questions regarding the use and suitability for the specific application, the user has the possibility to directly contact the respective technical contact person of the relevant manufacturer or supplier. See for further information Terms of Use.

Information Desk