Three Bond 2217H
Adhesive Bonding Technology
Three Bond 2217H is a one-component epoxy resin and is characterized by its short cure times. Its rheological properties make it suitable for fully automated and screen printing applications.
Excellent electrical properties, excellent chemical and thermal resistance, combined with the possibility of rapid application and curing at low temperatures as 80°C, make Three Bond 2217H the ideal choice when it comes to SMD applications and PCB assembly with chips, QFPs and other components.
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