Three Bond 2217H

Adhesive Bonding Technology

Three Bond 2217H is a one-component epoxy resin and is characterized by its short cure times. Its rheological properties make it suitable for fully automated and screen printing applications.

Excellent electrical properties, excellent chemical and thermal resistance, combined with the possibility of rapid application and curing at low temperatures as 80°C, make Three Bond 2217H the ideal choice when it comes to SMD applications and PCB assembly with chips, QFPs and other components.

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Three Bond GmbH
Adhesive Bonding Technology

“Creating Our Future From a Single Drop”

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Features

Sector expertise
Manufacuting industry
Adhesive and sealant systems
Adhesive
Components
1-part systems
1-part systems
1-part epoxy resins
Thermoplastics
PBT
PC
PET
PMMA
PVC (harder perfomance)
Thermosetting Plastics
EP
Composites
CRP
BMC
FR4
GRP
SMC
Metals
aluminium
cast iron
copper
magnesium
magnets
brass
steel - blasted SA 2,5
steel - stainless
zinc (also galvanized materials)
Glass & Ceramic Materials
glass
Size of application area
µm²-/µm³ range - micro parts
mm²-/mm³range - precision parts
cm²-/cm³ range - component
Curing mechanisms
warm-/hot curing
(Mixed) viscosity
pasty
thixotropic
Packaging unit
small packaging unit (can, tube, etc.)
cartridge (1- or 2-part)
temperature resistance <0°C (approx.)
from -40°C
temperature resistance >0°C (approx.)
to +150°C
colour and colour fastness
colour spectrum bright
red
Shore-D
Sh-D 81 to 100
deformation capability
≤ 10%
Ecological requirements
VOC-free
Application Types
dot application
line, bead application
surface coating
Microtechnology / chipbonden
die-attach
flip-chip
underfiller

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