Bonding CR to CR

These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:

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Features

CR

Polychloroprene


Preview results

Polytec EC 101 - Electrically Conductive Adhesive
Adhesive Bonding Technology

Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.

epple K20 R
Adhesive Bonding Technology

1-part fast curing contct adhesive on thermoplastic caoutchouc basis. Pressure-sensitive adhesive or as laminating adhesive, high adhesive strength.

MD MK 3000
Adhesive Bonding Technology

Bonds immediately, is the new generation of the mounting adhesive, is not shrinking, is very well suited for natural stones, hardens quickly.

MD MS 2K Polymer
Adhesive Bonding Technology

Low odor, permanently elastic, wet on wet applicable, good resistance to oils, fats, water, aliphatic solvents etc.

epple 5851-new
Adhesive Bonding Technology

2-part contact adhesive on chloroprene basis. Bonding of plastics among each other or with metals, as well as bonding of rubber parts. Highly elastic adhesive film.

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