Project Support – Adhesive Bonding Processes
These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:
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Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.
Medium viscosity black rubber toughened cyanoacrylate adhesive. It gives fast cures on the majority of industrial substrates and is particularly suitable for bonding rubbers, metals and plastics.
Bylamet EL-35 shows better properties of impact resistance, peeling resistance, water resistance and heat resistance than regular Bylamet types.
Specially for bonding different kinds of wood and leather, 100 ~ 2000 mPas.
Fastest setting type, bonding of balsa too, in a few seconds, 3 mPas.