Project Support – Adhesive Bonding Processes
These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:
Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.
0.8 mm double-sided foam tape for LSE surfaces: plastic to plastic application in automotive interior.
Dual-curing, heat resistant product. Very fast activator free prefixing or throughout curing of excess adhesive by UV-curing (365 nm).
Medium strength product, which seals flanges as well as other flat surfaces against a wide range of gases and chemicals. Certified acc. to NSF ANSI 61 for use in commercial and residential potable water systems not exceeding 82°C. NSF P1 listed for use in food processing areas.