Project Support – Adhesive Bonding Processes

These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:

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Polytec EC 101 - Electrically Conductive Adhesive
Adhesive Bonding Technology

Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.

tesa® 92108 HiP – High initial Performance
Adhesive Bonding Technology

0.8 mm double-sided foam tape for LSE surfaces: plastic to plastic application in automotive interior.

Kisling 2453
Adhesive Bonding Technology

Dual-curing, heat resistant product. Very fast activator free prefixing or throughout curing of excess adhesive by UV-curing (365 nm).

Kisling 4253
Adhesive Bonding Technology

Medium strength product, which seals flanges as well as other flat surfaces against a wide range of gases and chemicals. Certified acc. to NSF ANSI 61 for use in commercial and residential potable water systems not exceeding 82°C. NSF P1 listed for use in food processing areas.

tesa® ACXplus 7808 Black Line
Adhesive Bonding Technology

0.8 mm double-sided acrylic foam tape for mounting automotive exterior trims and parts.

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