Kisling 1810
Adhesive Bonding Technology
The product is suitable to bond metals like aluminum, steel, brass and its alloys as well as ferrite and combinations.
It is a two-component system and cures after mixing into a tack-free, high-strength and impact resisting polymer film. The best mixture-ratio is 1:1 (V:V) and is obtainable without problems by using the common double-cartridges.
Advantages
- Fast curing system
- High tensile shear strength
- Resists against impacts as well as against peeling
- Good gap-filling behaviour up to 0.5 mm
- Free of solvents
- Short fixture time and reliable curing
Kisling is a leading manufacturer of high-quality adhesives, sealants and encapsulants for almost every line of industry- electronics, mechanical engineering, pump and valve construction and mobility.
Contact Form
Features
The search results from SUBSTRATEC are not sales recommendations and/or professional technical advice. It is only intended to make it easier for the user to pre-select suitable system that may be available. SUBSTRATEC gives no guarantee that the system suggested is successful or suitable for the specific area of application of the user. In the event of any questions regarding the use and suitability for the specific application, the user has the possibility to directly contact the respective technical contact person of the relevant manufacturer or supplier. See for further information Terms of Use.