Project Support – Adhesive Bonding Processes

These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:

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Copper

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Nickel


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tesa® 92108 HiP – High initial Performance
Bonding Technology

0.8 mm double-sided foam tape for LSE surfaces: plastic to plastic application in automotive interior.

COSMO HD-100.600
Bonding Technology

MS sealant for adhesive and sealing applications in various industries with excellent adhesion to EPDM.

MD screw retention 585.243
Bonding Technology

Vibration-resistant, one-component – clean and easy to apply, suitable for all thread types and shapes, seals inside the thread immediate.

Ceramabond 571 – High Temperature Ceramic Adhesive
Bonding Technology

High temperature ceramic adhesive, filled with magnesium oxide, for applications in the field of heating elements, induction coils and sensors.

MD MK 3000
Bonding Technology

Bonds immediately, is the new generation of the mounting adhesive, is not shrinking, is very well suited for natural stones, hardens quickly.

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