Bonding CR to PA 6.6
These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:
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Features
Polyamide 6.6
Polychloroprene
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Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.
Only a few drops of this super-fast instant glue suffice for most applications in order to achieve powerful assemblies. The practical PE-bottles make possible a dot-like accurate application of the adhesive onto the parts to be bonded.
Construction adhesive based on methyl-acrylate for special plastics | transparent | for low surface energy plastics | for small bonding gaps.
Medium viscosity black rubber toughened cyanoacrylate adhesive. It gives fast cures on the majority of industrial substrates and is particularly suitable for bonding rubbers, metals and plastics.
Bylamet EL-35 shows better properties of impact resistance, peeling resistance, water resistance and heat resistance than regular Bylamet types.