Bonding copper to PA 6.6
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Features
Polyamide 6.6
Copper
Preview results
Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.
0.8 mm double-sided foam tape for LSE surfaces: plastic to plastic application in automotive interior.
MS sealant for adhesive and sealing applications in various industries with excellent adhesion to EPDM.
Pasty, two component epoxy with curing at room temperature, used for thermal management in electronics, hybrid technology, sensor technology and power engineering.
0.8 mm double-sided acrylic foam tape for mounting automotive exterior trims and parts.