Bonding FR4 to PA 6.6
These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:
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Epoxy resin / fiberglass fabric
Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.
0.8 mm double-sided foam tape for LSE surfaces: plastic to plastic application in automotive interior.
Bonds metal, stone, woods, plastics and ceramics. Extremely high strength, weatherproof, easy to use.
Heat-curing adhesive, low-temperature-curing from +60 °C, particularly suitable for the use with temperature-sensitive substrates
Pasty, two component epoxy with curing at room temperature, used for thermal management in electronics, hybrid technology, sensor technology and power engineering.