Bonding FR4 to PA 6.6

These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:

Search engine for adhesives technologies >>>

Search engine for surface technologies >>>

Search engine for processing systems >>>


Features

PA (PA 6.6)

Polyamide 6.6

FR4

Epoxy resin / fiberglass fabric


Preview results

Polytec EP 610 - Unfilled Epoxy Adhesive
Bonding Technology

Polytec EP 610 is a transparent, two-component epoxy adhesive of very low viscosity and high flexibility. It is suggested for applications in optics, fiber optics, optoelectronics, medical and semiconductor technology.

Polytec EC 101 - Electrically Conductive Adhesive
Bonding Technology

Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.

tesa® 92108 HiP – High initial Performance
Bonding Technology

0.8 mm double-sided foam tape for LSE surfaces: plastic to plastic application in automotive interior.

DELO KATIOBOND 4594
Bonding Technology

Light-activated EP adhesive, high-viscous, thixotropic

MD Megabond 2000
Bonding Technology

Bonds metal, stone, woods, plastics and ceramics. Extremely high strength, weatherproof, easy to use.

More results

» See more results