Bonding PA to PA 12

These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:

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Features

PA

Polyamide

PA (PA 12)

Polyamide 12


Preview results

Polytec EC 101 - Electrically Conductive Adhesive
Bonding Technology

Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.

tesa® 92108 HiP – High initial Performance
Bonding Technology

0.8 mm double-sided foam tape for LSE surfaces: plastic to plastic application in automotive interior.

COSMO HD-100.600
Bonding Technology

MS sealant for adhesive and sealing applications in various industries with excellent adhesion to EPDM.

DuploCOLL® 50001 LSE
Bonding Technology

Double-sided pressure sensitive adhesive tape with a white polyethylene foam carrier and an aggressive synthetic rubber adhesive.

DELO KATIOBOND 4594
Bonding Technology

Light-activated EP adhesive, high-viscous, thixotropic

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