Project Support – Adhesive Bonding Processes

These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:

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Features

ASA

Acrylic ester-styrene-acrylonitrile

XPS (rigid foam)

Extruded polystyrene (rigid foam)


Preview results

Polytec EP 610 - Unfilled Epoxy Adhesive
Bonding Technology

Polytec EP 610 is a transparent, two-component epoxy adhesive of very low viscosity and high flexibility. It is suggested for applications in optics, fiber optics, optoelectronics, medical and semiconductor technology.

Polytec EC 101 - Electrically Conductive Adhesive
Bonding Technology

Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.

tesa® 92108 HiP – High initial Performance
Bonding Technology

0.8 mm double-sided foam tape for LSE surfaces: plastic to plastic application in automotive interior.

DuploCOLL® 5015
Bonding Technology

Double-sided pressure sensitive adhesive mounting tape with a modified acrylic adhesive and a compressible foam carrier.

DuploCOLL® 50001 LSE
Bonding Technology

Double-sided pressure sensitive adhesive tape with a white polyethylene foam carrier and an aggressive synthetic rubber adhesive.

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