Bonding XPS rigid foam to CR
These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:
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Features
Extruded polystyrene (rigid foam)
Polychloroprene
Preview results
Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.
Bonds immediately, is the new generation of the mounting adhesive, is not shrinking, is very well suited for natural stones, hardens quickly.
Low odor, permanently elastic, wet on wet applicable, good resistance to oils, fats, water, aliphatic solvents etc.
Medium viscosity black rubber toughened cyanoacrylate adhesive. It gives fast cures on the majority of industrial substrates and is particularly suitable for bonding rubbers, metals and plastics.