Bonding XPS rigid foam to CR

These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:

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Features

XPS (rigid foam)

Extruded polystyrene (rigid foam)

CR

Polychloroprene


Preview results

Polytec EC 101 - Electrically Conductive Adhesive
Bonding Technology

Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.

MD MK 3000
Bonding Technology

Bonds immediately, is the new generation of the mounting adhesive, is not shrinking, is very well suited for natural stones, hardens quickly.

WELDYX PROFESSIONAL 5 BLACK
Bonding Technology

High-performance adhesive developed especially for structural bonding of metals, composites and plastics.

MD MS 2K Polymer
Bonding Technology

Low odor, permanently elastic, wet on wet applicable, good resistance to oils, fats, water, aliphatic solvents etc.

MD MS Polymer
Bonding Technology

Fast curing, odorless, wet on wet applicable, sanded.

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