Project Support – Adhesive Bonding Processes
These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:
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Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.
0.8 mm double-sided foam tape for LSE surfaces: plastic to plastic application in automotive interior.
1665 is a non-sagging, two-part methacrylate adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.
1675 is a non-sagging, two-part methacrylate adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.
Two component toughened methacrylate adhesive system. Application and curing under water and in humid areas.