Project Support – Adhesive Bonding Processes

These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:

Search engine for adhesives technologies >>>

Search engine for surface treatment >>>

Search engine for dispensing and processing systems >>>


Features

MF

Melamine formaldehyde resins (MF) are synthetic resins of the group of aminoplasts. Aminoplasts are polycondensation resins made from carbonyl compounds and compounds containing an NH group. MF is based on melamine and formaldehyde. They are relatively stable both mechanically and thermally. © 2021 SUBSTRATEC. All Rights Reserved.

silicium

Silicium


Preview results

Polytec EC 101 - Electrically Conductive Adhesive
Adhesive Bonding Technology

Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.

tesa® 92108 HiP – High initial Performance
Adhesive Bonding Technology

0.8 mm double-sided foam tape for LSE surfaces: plastic to plastic application in automotive interior.

COSMO HD-100.600
Adhesive Bonding Technology

MS sealant for adhesive and sealing applications in various industries with excellent adhesion to EPDM.

MD Megabond 2000
Adhesive Bonding Technology

Bonds metal, stone, woods, plastics and ceramics. Extremely high strength, weatherproof, easy to use.

Polytec TC 411 - Thermally Conductive Adhesive
Adhesive Bonding Technology

Pasty, two component epoxy with curing at room temperature, used for thermal management in electronics, hybrid technology, sensor technology and power engineering.

More results

» See more results