Bonding PF to BMC
These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:
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Features
Phenoplast
Bulk molding compounds
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Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.
0.8 mm double-sided foam tape for LSE surfaces: plastic to plastic application in automotive interior.
Bonds metal, stone, woods, plastics and ceramics. Extremely high strength, weatherproof, easy to use.
COSMO PU-160.110, constructional adhesive with hard and tough glued joint, is used in the wood processing, in the dry construction for the bonding of overlapping edges of floor pavement elements or as surface adhesive for a lot of industrial applications.
Pasty, two component epoxy with curing at room temperature, used for thermal management in electronics, hybrid technology, sensor technology and power engineering.