Project Support – Adhesive Bonding Processes

These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:

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silver

Silver (Ag) is a chemical element of the 5th period. It is characterized by the highest electrical conductivity of all elements and the highest thermal conductivity of all metals. Silver is one of the soft and malleable metals. Like all precious metals, silver is one of the heavy metals. In most cases silver is won from ores of copper, copper-nickel, lead or lead-zinc but also a refining of silver (electrolytic copper cleaning). © 2021 SUBSTRATEC. All Rights Reserved.


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Polytec EC 101 - Electrically Conductive Adhesive
Adhesive Bonding Technology

Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.

tesa® 92108 HiP – High initial Performance
Adhesive Bonding Technology

0.8 mm double-sided foam tape for LSE surfaces: plastic to plastic application in automotive interior.

MD screw retention 585.243
Adhesive Bonding Technology

Vibration-resistant, one-component – clean and easy to apply, suitable for all thread types and shapes, seals inside the thread immediate.

Ceramabond 571 – High Temperature Ceramic Adhesive
Adhesive Bonding Technology

High temperature ceramic adhesive, filled with magnesium oxide, for applications in the field of heating elements, induction coils and sensors.

Polytec TC 411 - Thermally Conductive Adhesive
Adhesive Bonding Technology

Pasty, two component epoxy with curing at room temperature, used for thermal management in electronics, hybrid technology, sensor technology and power engineering.

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