Project Support – Adhesive Bonding Processes
These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:
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The product is suitable to bond metals like aluminum, steel, brass and its alloys as well as ferrite and combinations.
Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.
0.8 mm double-sided foam tape for LSE surfaces: plastic to plastic application in automotive interior.
Very fast curing product for highest static shear strength, as well as for dynamic loads.
Kisling's 1670 is a non-sagging, two-part methylmethacrylate adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.