Bonding PPE to XPS rigid foam

These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:

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Features

PPE

Polyphenylene ether

XPS (rigid foam)

Extruded polystyrene (rigid foam)


Preview results

Polytec EC 101 - Electrically Conductive Adhesive
Adhesive Bonding Technology

Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.

tesa® 92108 HiP – High initial Performance
Adhesive Bonding Technology

0.8 mm double-sided foam tape for LSE surfaces: plastic to plastic application in automotive interior.

Drei Bond 9160
Adhesive Bonding Technology

Drei Bond 9160 is an elastic, one component MS-Polymer. Sealant and adhesive for bonding vehicle bodywork, containers and vehicle manufacture, air conditioning and heating equipment, metal work etc.

Polytec TC 411 - Thermally Conductive Adhesive
Adhesive Bonding Technology

Pasty, two component epoxy with curing at room temperature, used for thermal management in electronics, hybrid technology, sensor technology and power engineering.

Polytec TC 417 - Thermally Conductive Adhesive
Adhesive Bonding Technology

Polytec TC 417 is a two component, thermally conductive, electrically insulating epoxy. It is used in various thermal management applications, especially for potting of large volumes.

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