Project Support – Adhesive Bonding Processes
These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:
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Polystyrene (PS) is usually obtained by chain polymerization of styrene. It is an aromatic polymer and belongs to the group of thermoplastics. The tacticity describes the position of the phenyl group in the polymer. The position can be random, alternating or even. Depending on which case PS is divided into atactic, syndiotactic and isotactic PS. This determines whether the plastic is amorphous or semi-crystalline. PS is often used for disposable plastics, CD cases etc. © 2021 SUBSTRATEC. All Rights Reserved.
Zinc (also galvanized materials)
Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.
0.8 mm double-sided foam tape for LSE surfaces: plastic to plastic application in automotive interior.
Drei Bond 9160 is an elastic, one-component MS-Polymer. Sealant and adhesive for bonding vehicle bodywork, containers and vehicle manufacture, air conditioning and heating equipment, metal work etc.
Pasty, two component epoxy with curing at room temperature, used for thermal management in electronics, hybrid technology, sensor technology and power engineering.
Bonds immediately, is the new generation of the mounting adhesive, is not shrinking, is very well suited for natural stones, hardens quickly.