Bonding SAN to EP
These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:
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Styrene / acrylonitrile
Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.
0.8 mm double-sided foam tape for LSE surfaces: plastic to plastic application in automotive interior.
Double-sided pressure sensitive adhesive mounting tape with a modified acrylic adhesive and a compressible foam carrier.
1665 is a non-sagging, two-part methacrylate adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.
Double-sided pressure sensitive adhesive tape with a white polyethylene foam carrier and an aggressive synthetic rubber adhesive.